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Patent # Description
US-9,935,114 Methods of forming an array comprising pairs of vertically opposed capacitors and arrays comprising pairs of...
A method of forming an array comprising pairs of vertically opposed capacitors comprises forming a conductive lining in individual capacitor openings in support...
US-9,935,085 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods are disclosed. A representative system in accordance with a...
US-9,935,082 Stacked semiconductor dies with selective capillary under fill
Stacked semiconductor dies are provided with selective capillary under fill to avoid wafer warpage during curing. In one embodiment, a method of manufacturing a...
US-9,934,870 Apparatuses and methods for memory testing and repair
Some embodiments include apparatuses and methods having a first interface to communicate with a processing unit, a second interface to communicate with a memory...
US-9,934,869 Apparatuses and methods for flexible fuse transmission
Apparatuses and methods for transmitting fuse data from fuse arrays to latches are described. An example apparatus includes: a plurality of fuse arrays, each...
US-9,934,856 Apparatuses and methods for comparing data patterns in memory
Apparatuses and methods related to comparing data patterns in memory. An example method can include comparing a number of data patterns stored in a memory array...
US-9,934,850 Accessing memory cells in parallel in a cross-point array
Methods and structures for accessing memory cells in parallel in a cross-point array include accessing in parallel a first memory cell disposed between a first...
US-9,934,839 Dynamic adjustment of memory cell digit line capacitance
Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ferroelectric memory cell may be used to store a logic state....
US-9,934,837 Ground reference scheme for a memory cell
Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A ground reference scheme may be employed in a digit line...
US-9,934,832 Apparatuses and methods for detecting frequency ranges corresponding to signal delays of conductive VIAS
Apparatuses for monitoring a signal on a conductive via are described. An example apparatus includes: a controller, a first conductive via, a second conductive...
US-9,934,831 Apparatuses and methods for storing and writing multiple parameter codes for memory operating parameters
Apparatuses and methods for writing and storing parameter codes for operating parameters, and selecting between the parameter codes to set an operating...
US-9,934,812 Tension feedback for tape tension
A tension feedback signal is generated to reduce tension variation on a tape occurring at a reel frequency. Tension variation information may be obtained and...
US-9,934,086 Apparatuses and methods for selective determination of data error repair
Apparatuses and methods are described for selective determination of data error repair. An example apparatus includes a memory array and a controller coupled to...
US-9,933,972 Methods of accessing memory cells, methods of distributing memory requests, systems, and memory controllers
Methods of accessing memory cells, methods of distributing memory requests, systems, and memory controllers are described. In one such method, where memory...
US-9,933,225 Bipod with a quick connect feature for standard rails
A bipod with a quick connect feature that engages with a standard rail. The bipod includes a pair legs pivotally attached at a pivot axis. A biasing mechanism...
US-9,932,506 Hydrocarbon based refrigerant
An environmentally friendly hydrocarbon refrigerant mixture may be used as a substitute for existing refrigerant in a refrigerant system. The hydrocarbon...
US-9,932,505 Hydrocarbon based refrigerant
An environmentally friendly hydrocarbon refrigerant mixture may be used as a substitute for existing refrigerant in a refrigerant system. The hydrocarbon...
US-9,931,190 Protective device for the head and ears of an animal
A protective cover device for an animal's head includes a first portion for securement around the animal's neck, behind the occiput and at or near the smallest...
US-9,931,103 Combination urinary funnel and biological indicator test device
A urinary funnel has proximal and distal openings and is preferably made from a resilient web scored to define two side panels foldable at a lower fold line...
US-D814,562 Printer
US-D814,344 Terracotta pot holder
US-9,930,281 Image sensors having photodiode regions implanted from multiple sides of a substrate
An image sensor with an array of pixels is provided. The array may include a semiconductor substrate having opposing first and second sides. A first photodiode...
US-9,930,264 Method and apparatus providing pixel array having automatic light control pixels and image capture pixels
A pixel array uses two sets of pixels to provide accurate exposure control. One set of pixels provide continuous output signals for automatic light control...
US-9,929,967 Packet deconstruction/reconstruction and link-control
The present disclosure includes methods, devices, and systems for packet processing. One method embodiment for packet flow control includes deconstructing a...
US-9,929,229 Process of manufacturing an open pattern inductor
Various embodiments includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality...
US-9,929,175 Stack of horizontally extending and vertically overlapping features, methods of forming circuitry components,...
A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The stack has a primary portion...
US-9,929,135 Apparatuses and methods for semiconductor circuit layout
Apparatuses including circuit layout regions of a semiconductor device and methods of designing the circuit layout regions of a semiconductor device are...
US-9,929,064 Through-substrate via (TSV) testing
Various embodiments comprise apparatuses and methods for testing and repairing through-substrate vias in a stack of interconnected dice. In various embodiments,...
US-9,929,019 Patterns forming method
A patterns forming method begins with performing a lithography process on a photoresist film with a photomask having first apertures in a first mask region and...
US-9,929,006 Silicon chalcogenate precursors, methods of forming the silicon chalcogenate precursors, and related methods of...
A silicon chalcogenate precursor comprising the chemical formula of Si(XR.sup.1).sub.nR.sup.2.sub.4-n, where X is sulfur, selenium, or tellurium, R.sup.1 is...
US-9,928,894 Writing to cross-point non-volatile memory
Methods, systems, and devices for preventing disturb of untargeted memory cells during repeated access operations of target memory cells are described for a...
US-9,928,887 Data shift by elements of a vector in memory
Examples of the present disclosure provide apparatuses and methods for performing shift operations in a memory. An example method comprises performing a shift...
US-9,928,171 Apparatuses and methods for providing data to a configurable storage area
Apparatuses and methods for providing data to a configurable storage area are disclosed herein. An example apparatus may include an extended address register...
US-9,927,975 Hybrid memory drives, computer system, and related method for operating a multi-mode hybrid drive
A multi-mode hybrid memory drive comprises a bulk memory device and a removable cache memory device. A controller of the bulk memory device may be configured to...
US-9,927,192 Buffer tube locking plate
Disclosed herein is a buffer tube locking plate assembly facilitating secure attachment of a buffer tube to a receiver portion of a firearm.
US-9,926,729 Retractable screen door handle assembly
A handle assembly includes a first handle, a second handle, and a magnet. The first handle is moveably attached to a first base. The second handle is moveably...
US-9,924,814 Cup sleeve
This document describes fixable cup sleeves. One of these cup sleeves is selectively fixable to a cup using a temperature-dependent adhesive that is effective...
US-9,924,647 Potato cultivar X17
A potato cultivar designated X17 is disclosed. The invention relates to the tubers of potato cultivar X17, to the seeds of potato cultivar X17, to the plants of...
US-D814,094 LED optic
US-D813,787 Cargo rack
US-D813,491 Conical potato piece
US-9,924,609 Modular protection cabinet with flexible backplane
An enclosure having a rear base defining a cavity for holding one or more electronic devices. The enclosure includes a front cover coupled to the rear base and...
US-9,923,779 Configuration of a software defined network
The present disclosure pertains to systems and method for configuration of communication flows in a software defined network ("SDN"). In one embodiment, a...
US-9,923,029 Semiconductor constructions, electronic systems, and methods of forming cross-point memory arrays
Some embodiments include selectively conducting devices having a first electrode, a second electrode, and dielectric material between the first and second...
US-9,922,924 Interposer and semiconductor package
An interposer and a semiconductor package including the interposer are provided. The interposer includes a first dielectric layer, a conductive pillar, a...
US-9,922,885 Semiconductor devices comprising nitrogen-doped gate dielectric
Some embodiments include semiconductor devices having first transistors of a first channel type and having second transistors of a second channel type. The...
US-9,922,875 Conductive interconnect structures incorporating negative thermal expansion materials and associated systems,...
Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device...
US-9,922,869 Electromagnetic radiation emitters and conduit structures
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for...
US-9,922,845 Semiconductor package and fabrication method thereof
A method for fabricating a semiconductor package is disclosed. A substrate is provided and a first passivation layer is formed on the substrate. Trenches are...
US-9,922,729 Soft post package repair of memory devices
Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store...
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